Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains furt...
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| Autor Corporativo: | |
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| Outros autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | English |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2010.
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| Edición: | 1st ed. 2010. |
| Series: | Integrated Circuits and Systems,
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| Subjects: | |
| Acceso en liña: | https://doi.org/10.1007/978-1-4419-6588-2 |
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Table of Contents:
- to Coupled Data Technologies
- Overview of 3D Technologies
- Power delivery, signaling and cooling for 2D and 3D integrated systems
- Coupled Data Technologies
- Capacitive Coupled Communication
- Inductive Coupled Communications
- Use of AC Coupled Interconnect in Contactless Packaging
- Enabling Coupled Data Technologies
- Aligning chips face-to-face for dense capacitive communication
- Extending Data Coupling Technologies
- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication
- AC Coupled Wireless Power Delivery.