תמונות העטיפה

Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains furt...

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שמור ב:
מידע ביבליוגרפי
מחבר תאגידי: SpringerLink (Online service)
מחברים אחרים: Ho, Ron. (Editor, http://id.loc.gov/vocabulary/relators/edt), Drost, Robert. (Editor, http://id.loc.gov/vocabulary/relators/edt)
פורמט: אלקטרוני ספר אלקטרוני
שפה:English
יצא לאור: New York, NY : Springer US : Imprint: Springer, 2010.
מהדורה:1st ed. 2010.
סדרה:Integrated Circuits and Systems,
נושאים:
Electronic circuits.
Electronics.
Microelectronics.
Electrical engineering.
Computer hardware.
Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Electrical Engineering.
Computer Hardware.
גישה מקוונת:https://doi.org/10.1007/978-1-4419-6588-2
תגים: הוספת תג
אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!
תוכן הענינים:
  • to Coupled Data Technologies
  • Overview of 3D Technologies
  • Power delivery, signaling and cooling for 2D and 3D integrated systems
  • Coupled Data Technologies
  • Capacitive Coupled Communication
  • Inductive Coupled Communications
  • Use of AC Coupled Interconnect in Contactless Packaging
  • Enabling Coupled Data Technologies
  • Aligning chips face-to-face for dense capacitive communication
  • Extending Data Coupling Technologies
  • Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication
  • AC Coupled Wireless Power Delivery.

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