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Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Bibliographic Details
Main Authors: Liu, Xingsheng. (Author, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2015.
Edition:1st ed. 2015.
Series:Micro- and Opto-Electronic Materials, Structures, and Systems,
Subjects:
Energy systems.
Energy Systems.
Online Access:https://doi.org/10.1007/978-1-4614-9263-4
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https://doi.org/10.1007/978-1-4614-9263-4

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