TY  - GEN
TY  - GEN
T1  - Packaging of High Power Semiconductor Lasers
T2  - Micro- and Opto-Electronic Materials, Structures, and Systems,
A1  - Liu, Xingsheng.
A2  - Zhao, Wei.
A2  - Xiong, Lingling.
A2  - Liu, Hui.
LA  - English
PP  - New York, NY
PB  - Springer New York : Imprint: Springer
YR  - 2015
ED  - 1st ed. 2015.
UL  - http://discoverylib.upm.edu.my/discovery/Record/978-1-4614-9263-4
AB  - This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
OP  - 402
CN  - TK1001-1841
SN  - 9781461492634
KW  - Energy systems.
KW  - Energy Systems.
ER  -