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Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Bibliographic Details
Main Authors: Lee, Tae-Kyu. (Author, http://id.loc.gov/vocabulary/relators/aut), Bieler, Thomas R. (http://id.loc.gov/vocabulary/relators/aut), Kim, Choong-Un. (http://id.loc.gov/vocabulary/relators/aut), Ma, Hongtao. (http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2015.
Edition:1st ed. 2015.
Subjects:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Circuits and Systems.
Online Access:https://doi.org/10.1007/978-1-4614-9266-5
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https://doi.org/10.1007/978-1-4614-9266-5

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