Modeling of Adhesively Bonded Joints
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide t...
Kaydedildi:
| Müşterek Yazar: | |
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| Diğer Yazarlar: | |
| Materyal Türü: | Elektronik Ekitap |
| Dil: | English |
| Baskı/Yayın Bilgisi: |
Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2008.
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| Edisyon: | 1st ed. 2008. |
| Konular: | |
| Online Erişim: | https://doi.org/10.1007/978-3-540-79056-3 |
| Etiketler: |
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