Carbon Nanotube Based VLSI Interconnects Analysis and Design /

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or othe...

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Những tác giả chính: Kaushik, Brajesh Kumar. (Tác giả, http://id.loc.gov/vocabulary/relators/aut), Majumder, Manoj Kumar. (http://id.loc.gov/vocabulary/relators/aut)
Tác giả của công ty: SpringerLink (Online service)
Định dạng: Điện tử eBook
Ngôn ngữ:English
Được phát hành: New Delhi : Springer India : Imprint: Springer, 2015.
Phiên bản:1st ed. 2015.
Loạt:SpringerBriefs in Applied Sciences and Technology,
Những chủ đề:
Truy cập trực tuyến:https://doi.org/10.1007/978-81-322-2047-3
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505 0 |a Interconnects -- Carbon Nanotube – Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References. 
520 |a The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models. 
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