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Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific iss...

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Ente Autore: SpringerLink (Online service)
Altri autori: Gusev, Evgeni. (Redattore, http://id.loc.gov/vocabulary/relators/edt), Garfunkel, Eric. (Redattore, http://id.loc.gov/vocabulary/relators/edt), Dideikin, Arthur. (Redattore, http://id.loc.gov/vocabulary/relators/edt)
Natura: Elettronico eBook
Lingua:English
Pubblicazione: Dordrecht : Springer Netherlands : Imprint: Springer, 2010.
Edizione:1st ed. 2010.
Serie:NATO Science for Peace and Security Series B: Physics and Biophysics,
Soggetti:
Metals.
Control engineering.
Robotics.
Mechatronics.
Electronics.
Microelectronics.
Biotechnology.
Nanotechnology.
Mechanics.
Metallic Materials.
Control, Robotics, Mechatronics.
Electronics and Microelectronics, Instrumentation.
Microengineering.
Nanotechnology and Microengineering.
Classical Mechanics.
Accesso online:https://doi.org/10.1007/978-90-481-3807-4
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Sommario:
  • MEMS/NEMS Technologies and Applications
  • History of Early Research on MEMS in Russia (U.S.S.R.)
  • Challenges of Complete CMOS/MEMS Systems Integration
  • MEMS for Practical Applications
  • Nanochip: A MEMS-Based Ultra-High Data Density Memory Device
  • Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU
  • Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors
  • Monocrystalline-Silicon Microwave MEMS Devices
  • Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites
  • MEMS Device and Reliability Physics
  • Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams
  • Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS
  • The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches
  • Advanced Processes and Materials
  • Development of DRIE for the Next Generation of MEMS Devices
  • Low-Temperature Processes for MEMS Device Fabrication
  • High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications
  • 3D Integration of MEMS and IC: Design, Technology and Simulations
  • Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices
  • Modeling of Dry Etching in Production of MEMS
  • XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures
  • Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys
  • Sensors
  • Smart Sensors: Advantages and Pitfalls
  • Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents
  • Integration of Diverse Biological Materials in Micro/Nano Devices
  • Force Sensing Optimization and Applications
  • Using Parametric Resonance to Improve Micro Gyrsocope Robustness.

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