An Expert System for Trouble Shooting - Auto Wire Bonder Machine
An expert system to trouble shoot auto Wire bonder machine has been developed at Dpak product line, Motorola Semiconductor Sdn. Bhd., Seremban. This expert system is to provide a systematic and analytical procedure to trouble shoot Delvotec 6830 auto wire bonder. A rule-based expert system using bac...
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| Format: | Abschlussarbeit |
| Sprache: | English |
| Veröffentlicht: |
1997
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| Online Zugang: | http://ethesis.upm.edu.my/id/eprint/4387/1/FK_1997_3_F.pdf |
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