TY  - JOUR
T1  - Structural, morphology and electrical properties of layered copper selenide thin film
A1  - Ying, Josephine Chyi Liew
LA  - English
PB  - Versita Warsaw and Springer
YR  - 2009
UL  - http://discoverylib.upm.edu.my/discovery/Record/oai:psasir.upm.edu.my:16870
AB  - Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.
ER  -