APA-viite

K., V. (2021). Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Elsevier.

Chicago-tyylinen lähdeviittaus

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

MLA-viite

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

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