Cita APA

K., V. (2021). Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Elsevier.

Citación estilo Chicago

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

Cita MLA

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

Warning: These citations may not always be 100% accurate.