Trích dẫn APA

K., V. (2021). Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Elsevier.

Trích dẫn kiểu Chicago

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

Trích dẫn MLA

K., Vidyatharran. Microstructural and Shear Strength Properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) Composite Solder Interconnects On Plain Cu and ENIAg Surface Finish. Elsevier, 2021.

Cảnh báo: Các trích dẫn này có thể không phải lúc nào cũng chính xác 100%.