Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder system was studied. Both plain and composite solder systems (SAC...
保存先:
| 主要な著者: | , , , , |
|---|---|
| フォーマット: | 論文 |
| 出版事項: |
Elsevier
2021
|
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|