Descripción: Advanced packaging

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Detalles Bibliográficos
Título anterior:	Hybrid circuit technology
Formato:	Electrónico Revista
Lenguaje:	English
Publicado:	Libertyville, Ill., USA : IHS Pub. Group, c1992-
Materias:	Hybrid integrated circuits > Design and construction > Periodicals. Microelectronic packaging > Periodicals. Hybrid integrated circuits > Design and construction. Microelectronic packaging. Electronic journals.
Acceso en línea:	Full text available from ABI/INFORM Trade & Industry: 01/01/2005 to 01/31/2009 Full text available from Advanced Technologies & Aerospace Database: 01/01/2005 to 01/31/2009 Full text available from Career & Technical Education Database: 01/01/2005 to 01/31/2009 Full text available from Engineering Database: 01/01/2005 to 01/31/2009 Full text available from Materials Science Database: 01/01/2005 to 01/31/2009 Full text available from Science Database: 01/01/2005 to 01/31/2009
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Descripción
Publicado:	Vol. 1, no. 1 (summer 1992)-
descripción de la copia:	Title from cover. Publisher varies.
Frecuencia de Publicación:	9 times a year, 2006-
ISSN:	0747-1599
Acceso:	License restrictions may limit access.