Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies

le Dele-Afolabi, T.T., Ansari, M.N.M., Azmah Hanim, M.A., Oyekanmi, A.A., Ojo-Kupoluyi, O.J., Atiqah, A.
Foilsithe 2023

Effect of sugar palm nanofibrillated cellulose concentrations on morphological, mechanical and physical properties of biodegradable films based on agro-waste sugar palm (Arenga pin...

le Rushdan, Ahmad Ilyas, Salit, Mohd Sapuan, Ibrahim, Rushdan, Abral, Hairul, Ishak, Mohamad Ridzwan, Zainudin, Edi Syams, Mahamud, S. N. Atikah, Norizan, Mohd Nurazzi, A., Atiqah, Ansari, M. N. M, Edi Syafri, Mochamad Asrofi, Nasmi Herlina Sari, Jumaidin, Ridhwan
Foilsithe 2019