Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

by Dele-Afolabi, Temitope T., Hanim, M. A. Azmah, Vidyatharran, K., Amin Matori, Khamirul Amin, O. Saliza, Azlina, Recep, Çalin
Published 2022