Solder joint reliability : theory and applications /
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| Other Authors: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Van Nostrand Reinhold,
1991.
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| Subjects: | |
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| 003 | UPM | ||
| 005 | 20161024050604.0 | ||
| 008 | 911111s1991 nyua 00100 eng | ||
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| 090 | 0 | 0 | |a TA492 W4S684 |
| 245 | 1 | 0 | |a Solder joint reliability : |b theory and applications / |c [edited by] John H. Lau. |
| 260 | |a New York : |b Van Nostrand Reinhold, |c 1991. | ||
| 300 | |a 631p. : |b ill. ; |c 24cm. | ||
| 650 | 0 | |a Welded joints. | |
| 650 | 0 | |a Solder and soldering. | |
| 700 | 1 | |a Lau, John H. | |
| 942 | |2 lcc |c 30000 | ||
| 999 | |c 528197 |d 528197 | ||
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