Characterization and modification of organosolv lignin for utilizing as a natural adhesive in MDF
With the increasing concern over environment and health issues, replacement of formaldehyde based adhesive with some natural and eco-friendly adhesive is the main focus of research for people working in the area of wood adhesives. Due to large availability and structural composition, researcher alwa...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Proceedings Paper |
| Language: | English |
| Published: |
Penerbit Universiti Malaysia Pahang
2018
|
| Subjects: | |
| Online Access: | http://agris.upm.edu.my:8080/dspace/handle/0/14194 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | With the increasing concern over environment and health issues, replacement of formaldehyde based adhesive with some natural and eco-friendly adhesive is the main focus of research for people working in the area of wood adhesives. Due to large availability and structural composition, researcher always looks toward lignin as the biggest hope for future adhesive. In the present work, potential of lignin as natural binder in the MDF was studied. Rubber wood fiber was treated with laccase enzyme and after the reaction, the solution containing mainly lignin and traces of organic compound all together called as Organosolv lignin (OSL) was collected and concentrated till the solution reaches 3% solid content. MDF boards were prepared by using Organosolv lignin and wood fibers. FTIR and XRD tests were done to study the changes in the morphology of fibers and the results were compared with the untreated fibers. FTIR results showed a clear difference in functional groups and the crystallinity of the fibers was improved. Organosolv lignin was also studied separately by FTIR and DSC and the results were compared with UF resin. The curing pattern of Organosolv was found similar to urea formaldehyde (UF) adhesive. The mechanical tests were conducted and the results were compared with the boards prepared by using UF resin. A 6 mm board with 800kg/m3 density had average value of modulus of rupture(MOR)34 MPa and average internal bonding (IB) 0.68 MPa,, the boards have passed the required ASTM standard. |
|---|