Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
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| Hovedforfatter: | |
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| Institution som forfatter: | |
| Format: | Electronisk eBog |
| Sprog: | English |
| Udgivet: |
New York, NY :
Springer US : Imprint: Springer,
2007.
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| Udgivelse: | 1st ed. 2007. |
| Fag: | |
| Online adgang: | https://doi.org/10.1007/0-387-33913-2 |
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