Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
Saved in:
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2007.
|
| Edition: | 1st ed. 2007. |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/0-387-33913-2 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|