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Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Tan, Chuan Seng. (Editor, http://id.loc.gov/vocabulary/relators/edt), Gutmann, Ronald J. (Editor, http://id.loc.gov/vocabulary/relators/edt), Reif, L. Rafael. (Editor, http://id.loc.gov/vocabulary/relators/edt)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2008.
Edition:1st ed. 2008.
Series:Integrated Circuits and Systems,
Subjects:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials—Surfaces.
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Surfaces and Interfaces, Thin Films.
Engineering, general.
Online Access:https://doi.org/10.1007/978-0-387-76534-1
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https://doi.org/10.1007/978-0-387-76534-1

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