Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
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| 主要作者: | |
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| 企業作者: | |
| 格式: | 電子 電子書 |
| 語言: | English |
| 出版: |
New York, NY :
Springer US : Imprint: Springer,
2007.
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| 版: | 1st ed. 2007. |
| 主題: | |
| 在線閱讀: | https://doi.org/10.1007/0-387-33913-2 |
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