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Bonding in Microsystem Technology

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...

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Bibliographic Details
Main Author: Dziuban, Jan A. (Author, http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Dordrecht : Springer Netherlands : Imprint: Springer, 2006.
Edition:1st ed. 2006.
Series:Springer Series in Advanced Microelectronics, 24
Subjects:
Mechanics.
Mechanics, Applied.
Engineering.
Optical materials.
Electronic materials.
Electronics.
Microelectronics.
Manufactures.
Solid Mechanics.
Engineering, general.
Optical and Electronic Materials.
Electronics and Microelectronics, Instrumentation.
Manufacturing, Machines, Tools, Processes.
Online Access:https://doi.org/10.1007/1-4020-4589-1
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https://doi.org/10.1007/1-4020-4589-1

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