Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
Wedi'i Gadw mewn:
| Prif Awdur: | |
|---|---|
| Awdur Corfforaethol: | |
| Fformat: | Electronig eLyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2006.
|
| Rhifyn: | 1st ed. 2006. |
| Cyfres: | Springer Series in Advanced Microelectronics,
24 |
| Pynciau: | |
| Mynediad Ar-lein: | https://doi.org/10.1007/1-4020-4589-1 |
| Tagiau: |
Ychwanegu Tag
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
|
Byddwch y cyntaf i adael sylw!