Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
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| 主要作者: | |
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| 企業作者: | |
| 格式: | 電子 電子書 |
| 語言: | English |
| 出版: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2006.
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| 版: | 1st ed. 2006. |
| 叢編: | Springer Series in Advanced Microelectronics,
24 |
| 主題: | |
| 在線閱讀: | https://doi.org/10.1007/1-4020-4589-1 |
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