Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
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| 主要作者: | |
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| 企业作者: | |
| 格式: | 电子 电子书 |
| 语言: | English |
| 出版: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2006.
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| 版: | 1st ed. 2006. |
| 丛编: | Springer Series in Advanced Microelectronics,
24 |
| 主题: | |
| 在线阅读: | https://doi.org/10.1007/1-4020-4589-1 |
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