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Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Detalles Bibliográficos
Autores Principales: Lee, Tae-Kyu. (Autor, http://id.loc.gov/vocabulary/relators/aut), Bieler, Thomas R. (http://id.loc.gov/vocabulary/relators/aut), Kim, Choong-Un. (http://id.loc.gov/vocabulary/relators/aut), Ma, Hongtao. (http://id.loc.gov/vocabulary/relators/aut)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Materias:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Circuits and Systems.
Acceso en línea:https://doi.org/10.1007/978-1-4614-9266-5
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Tabla de Contenidos:
  • Introduction
  • Interconnection : The Joint
  • Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
  • Microstructure Development; Solidification and Isothermal Aging
  • Thermal Cycling Performance
  • Mechanical Stability and Performance
  • Chemical and Environment Attack
  • Challenges in Future Generation Interconnects: Microstructure Again.

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