Mục lục: Fundamentals of Lead-Free Solder Interconnect Technology

Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Chi tiết về thư mục
Những tác giả chính:	Lee, Tae-Kyu. (Tác giả, http://id.loc.gov/vocabulary/relators/aut), Bieler, Thomas R. (http://id.loc.gov/vocabulary/relators/aut), Kim, Choong-Un. (http://id.loc.gov/vocabulary/relators/aut), Ma, Hongtao. (http://id.loc.gov/vocabulary/relators/aut)
Tác giả của công ty:	SpringerLink (Online service)
Định dạng:	Điện tử eBook
Ngôn ngữ:	English
Được phát hành:	New York, NY : Springer US : Imprint: Springer, 2015.
Phiên bản:	1st ed. 2015.
Những chủ đề:	Electronics. Microelectronics. Optical materials. Electronic materials. Electronic circuits. Electronics and Microelectronics, Instrumentation. Optical and Electronic Materials. Circuits and Systems.
Truy cập trực tuyến:	https://doi.org/10.1007/978-1-4614-9266-5
Các nhãn:	Thêm thẻ Không có thẻ, Là người đầu tiên thẻ bản ghi này!

Mục lục:

Introduction
Interconnection : The Joint
Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
Microstructure Development; Solidification and Isothermal Aging
Thermal Cycling Performance
Mechanical Stability and Performance
Chemical and Environment Attack
Challenges in Future Generation Interconnects: Microstructure Again.

Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

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