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Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...

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Главный автор:	Greig, William. (Автор, http://id.loc.gov/vocabulary/relators/aut)
Соавтор:	SpringerLink (Online service)
Формат:	Электронный ресурс eКнига
Язык:	English
Опубликовано:	New York, NY : Springer US : Imprint: Springer, 2007.
Редактирование:	1st ed. 2007.
Предметы:	Electronics. Microelectronics. Electronic circuits. Engineering design. Optical materials. Electronic materials. Electronics and Microelectronics, Instrumentation. Circuits and Systems. Engineering Design. Optical and Electronic Materials.
Online-ссылка:	https://doi.org/10.1007/0-387-33913-2
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

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