Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
Wedi'i Gadw mewn:
| Prif Awduron: | , , , |
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| Awdur Corfforaethol: | |
| Fformat: | Electronig eLyfr |
| Iaith: | English |
| Cyhoeddwyd: |
New York, NY :
Springer New York : Imprint: Springer,
2015.
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| Rhifyn: | 1st ed. 2015. |
| Cyfres: | Micro- and Opto-Electronic Materials, Structures, and Systems,
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| Pynciau: | |
| Mynediad Ar-lein: | https://doi.org/10.1007/978-1-4614-9263-4 |
| Tagiau: |
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