Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Main Authors: Liu, Xingsheng. (Author, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
企业作者: SpringerLink (Online service)
格式: 电子 电子书
语言:English
出版: New York, NY : Springer New York : Imprint: Springer, 2015.
版:1st ed. 2015.
丛编:Micro- and Opto-Electronic Materials, Structures, and Systems,
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在线阅读:https://doi.org/10.1007/978-1-4614-9263-4
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