Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Bibliografiske detaljer
Main Authors: Liu, Xingsheng. (Author, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Institution som forfatter: SpringerLink (Online service)
Format: Electronisk eBog
Sprog:English
Udgivet: New York, NY : Springer New York : Imprint: Springer, 2015.
Udgivelse:1st ed. 2015.
Serier:Micro- and Opto-Electronic Materials, Structures, and Systems,
Fag:
Online adgang:https://doi.org/10.1007/978-1-4614-9263-4
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