Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

Cur síos iomlán

Saved in:
Sonraí Bibleagrafaíochta
Main Authors: Liu, Xingsheng. (Údar, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Údar Corparáideach: SpringerLink (Online service)
Formáid: Leictreonach ríomhLeabhar
Teanga:English
Foilsithe: New York, NY : Springer New York : Imprint: Springer, 2015.
Eagrán:1st ed. 2015.
Sraith:Micro- and Opto-Electronic Materials, Structures, and Systems,
Ábhair:
Rochtain Ar Líne:https://doi.org/10.1007/978-1-4614-9263-4
Clibeanna: Cuir Clib Leis
Gan Chlibeanna, Bí ar an gcéad duine leis an taifead seo a chlibeáil!