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Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

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Detalles Bibliográficos
Main Authors: Liu, Xingsheng. (Author, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:English
Publicado: New York, NY : Springer New York : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Series:Micro- and Opto-Electronic Materials, Structures, and Systems,
Subjects:
Energy systems.
Energy Systems.
Acceso en liña:https://doi.org/10.1007/978-1-4614-9263-4
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