Copertina

Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

Descrizione completa

Salvato in:
Dettagli Bibliografici
Autori principali: Liu, Xingsheng. (Autore, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Ente Autore: SpringerLink (Online service)
Natura: Elettronico eBook
Lingua:English
Pubblicazione: New York, NY : Springer New York : Imprint: Springer, 2015.
Edizione:1st ed. 2015.
Serie:Micro- and Opto-Electronic Materials, Structures, and Systems,
Soggetti:
Energy systems.
Energy Systems.
Accesso online:https://doi.org/10.1007/978-1-4614-9263-4
Tags: Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne! !
Lascia un commento!
Entra

Documenti analoghi