Slika na naslovnici

Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

Popoln opis

Shranjeno v:
Bibliografske podrobnosti
Main Authors: Liu, Xingsheng. (Author, http://id.loc.gov/vocabulary/relators/aut), Zhao, Wei. (http://id.loc.gov/vocabulary/relators/aut), Xiong, Lingling. (http://id.loc.gov/vocabulary/relators/aut), Liu, Hui. (http://id.loc.gov/vocabulary/relators/aut)
Korporativna značnica: SpringerLink (Online service)
Format: Elektronski eKnjiga
Jezik:English
Izdano: New York, NY : Springer New York : Imprint: Springer, 2015.
Izdaja:1st ed. 2015.
Serija:Micro- and Opto-Electronic Materials, Structures, and Systems,
Teme:
Energy systems.
Energy Systems.
Online dostop:https://doi.org/10.1007/978-1-4614-9263-4
Oznake: Označite
Brez oznak, prvi označite!
Komentirajte kot prvi!
Najprej se morate prijaviti

Podobne knjige/članki